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[3D Integrated Circuit]

Novel-Concept Silicon Integrated Circuits Derived from the 3-Dimensional Device, Circuit and Architecture	Tetsuo Endoh (Professor)

[3D Measurement]

High-Speed Vision for Real-Time Motion Analysis	Shingo Kagami (Professor)

[3D printing]

Additive Manufacturing of Metallic Parts with Electron Beam Melting (EBM)	Akihiko Chiba (Specially Appointed Professor(Research))
Advanced Nanotechnology for Critical metal free secondary battery	Itaru Homma (Professor)
Bioimplants that are as close to natural teeth as possible	Masahiro Yamada (Professor)

[3D-IC]

newCreating three-dimensional heterogeneous integration technology (chiplet integration technology) and bio-adaptive flexible hybrid electronics (FHE) to support next-generation AI and edge computing infrastructure.	Takafumi Fukushima (Professor)

[3D-LSI/TSV]

Development of Biomedical Micro/Nano Integrated System Using LSI Technology	Tetsu Tanaka (Professor)

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日本語 ENGLISH

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