Tohoku University. Research Profiles

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123

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[300mm wafer clean room]

International industry-academic consortium (CIES consortium) enhances creation of innovative integrated electronic technologies from material/process/LSI to software/tool/system (Center for Innovative Integrated Electronic Systems: CIES)

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Features
Integrated electronic systems are a fundamental technology that makes possible the lifestyles of ease and abundance we enjoy in the modern world. By leveraging innovative core technologies and longstanding accomplishments of industry-academic cooperation in Tohoku University as centripetal forces, we have promoted the CIES Consortium consisting of seven industry–academic collaborations, major national projects and community-based cooperation projects through our cooperation with a diverse range of Japanese and foreign companies from fields such as materials, equipment, devices, circuits and systems.  CIES has promoted world level Academic-Industrial Collaboration under establishment of world-first 300mm wafer process line and facilities for prototype manufacturing and characterizing spintronics integrated circuits compatible with world-class companies in university campus.


Targeted Application(s)/Industry
CIES has conducted international industry-academic collaboration in the fields of integrated electronic technologies ranging from materials/equipment to devices/systems. In addition, we have promoted to cooperate with regional and local companies with support of local government (Miyagi Prefecture, Sendai City etc) for contributing to Tohoku reconstruction and regional development. We welcome your participation in CIES consortium.

Center for Innovative Integrated Electronic Systems
ENDOH, Tetsuo, Professor Doctor of Engineering

[3D]

Interactive Content to Enrich Our Lives

(1) Displays and Interactive Techniques
Designing original display systems to show visual information accurately and effectively, and interaction techniques to make better use of these display systems.

(2) Interactive Video Content
Creating new interactive content from real video taken by cameras and computer-generated animations.

(3) Modeling and Controlling the “Atmosphere” in a Conversation Space
Aiming to stimulate the “atmosphere” in a conversation space by supplying real-time feedback to the users, we are exploring means of sensing and analyzing change in the space.

(4) Designing and Evaluating Novel Interaction Techniques
Designing and evaluating novel interaction techniques on target selection for variety types of displays including large and touch displays.

Research Institute of Electrical Communication
KITAMURA, Yoshifumi, Professor Doctor of Engineering

[3D atom probe]

Analysis and Function Elucidation of Fine Clusters and Defects in Materials Invisible by Electron Microscopy

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Features
It is well known that nano-scale impurity/solute clusters, defects, defect clusters and their complexes affect the mechanical and electrical properties in materials. However, it is very difficult to observe these objects even by state-of-the-art electron microscopes. We overcome the difficulty by employing noble two techniques: laser three-dimensional atom probe (3D-AP) technique and positron annihilation spectroscopy (PAS). Laser 3D-AP can map out each atom in various materials (metals, semiconductors, insulators) in three-dimensional real space with nearly atomic scale resolution. PAS can detect vacancy-type defects and defect-impurity complexes very sensitively.

Targeted Application(s)/Industry
By combining these methods, we are going to reveal the functions of the fine impurity clusters and defects to the materials: developments of new nano-structured materials, the mechanism of degradation of aged structural materials, the fall in the yield of semiconductor device production, and developments of quantum devices etc.

Institute for Materials Research
NAGAI, Yasuyoshi, Professor PhD

[3D Display]

Development of the high-quality and low-power display system for ultra-realistic communications

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Recently, with a spread of high definition video streaming services and ubiquitous network, development of high-quality, ultra-realistic and low-power display systems has been demanded. We have been studying physical properties of liquid crystal materials, precise control technique of polarization, high performance liquid crystal display (LCD) devices and its application to the advanced display systems for the realization of new media such as electric paper display and digital signage display, and low-energy society. We established a polarization control technology which realizes a precise control of polarization with liquid crystal materials. By using this world-leading technology, we have been studying the control of the surface alignment of liquid crystal molecules and developed a wide-viewing angle and fast switching liquid crystal display, ultra-high definition field-sequential-color display (Fig. 1), ultra-low power reflective full-color display (Fig. 2) and large-size high-quality display system.
We are also studying the ultra-realistic display systems such as a spatial 3D display and a multiple directional viewing display based on the precise light control technique as a next generation interactive communication technologies (Fig.3). We hope to conduct collaborative research with a willing company for a practical application of this technology in industry.

Graduate School of Engineering
ISHINABE, Takahiro, Associate Professor Doctor of Engineering

[3D Integrated Circuit]

Novel-Concept Silicon Integrated Circuits Derived from the 3-Dimensional Device, Circuit and Architecture

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In recent year, facing the age of nanoscale engineering, the new technologies of device, circuit and architecture supported by novel physical guidance principles are highly expected, just as the similar situation as the predawn of semiconductor technology when Bardeen and Shockley discovered the secret of transistors. Therefore, in our research approach, the architectures, circuits, devices and CAD design tools for nanoscale LSI are systematically investigated in the following three main research subjects.
1. Study on nanoscale device and circuit
Aiming at the nanoscale silicon semiconductor integrated circuit, we are mainly working on the following directions for new devices and circuits:
①Analysis for novel physical phenomenon based on nanostructural effects
②Device and circuit technology with new operating principle
③Restraint technology for increasing variability of device characteristics
④Architecture and circuit technology for robust information processing
2. Study on the 3-dimention-structual device and circuit
The elementary element of recent LSI with planar-structural devices is coming close to the physical limitation of scaling. In order to break the limit and sustain the evolution of future LSI performance, we have started the research on the novel 3-dimension-structural devices and circuits.
3. research on wireless integrated circuit (IC) based on information transmission
The ultracompact lightweight wireless IC is one of essential technologies for realizing the ubiquitous society which has the network available in anywhere, at anytime and from any surrounding items. For example, the IC tags for receiving information with reading function are getting close to the practical applications. In our laboratory, aiming at the automatic operating wireless IC with embedded power supply, we are systematically working on the following directions:
①The electrical power generation and storage devices
②Devices and circuits with Ultralow power consumption
③Sensing devices
For all above subjects, We hope to conduct collaborative researches with companies interested in our research.

Center for Innovative Integrated Electronic Systems
ENDOH, Tetsuo, Professor Doctor of Engineering

[3D Integrated Circuits]

International industry-academic consortium (CIES consortium) enhances creation of innovative integrated electronic technologies from material/process/LSI to software/tool/system (Center for Innovative Integrated Electronic Systems: CIES)

NEXT
PREV

Features
Integrated electronic systems are a fundamental technology that makes possible the lifestyles of ease and abundance we enjoy in the modern world. By leveraging innovative core technologies and longstanding accomplishments of industry-academic cooperation in Tohoku University as centripetal forces, we have promoted the CIES Consortium consisting of seven industry–academic collaborations, major national projects and community-based cooperation projects through our cooperation with a diverse range of Japanese and foreign companies from fields such as materials, equipment, devices, circuits and systems.  CIES has promoted world level Academic-Industrial Collaboration under establishment of world-first 300mm wafer process line and facilities for prototype manufacturing and characterizing spintronics integrated circuits compatible with world-class companies in university campus.


Targeted Application(s)/Industry
CIES has conducted international industry-academic collaboration in the fields of integrated electronic technologies ranging from materials/equipment to devices/systems. In addition, we have promoted to cooperate with regional and local companies with support of local government (Miyagi Prefecture, Sendai City etc) for contributing to Tohoku reconstruction and regional development. We welcome your participation in CIES consortium.

Center for Innovative Integrated Electronic Systems
ENDOH, Tetsuo, Professor Doctor of Engineering

[3D Measurement]

High-Speed Vision for Real-Time Motion Analysis

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Features
We are investigating high-speed vision systems that enable real-time image acquisition and visual processing at frame rates substantially higher than the standard video rate.

Targeted Application(s)/Industry
High-speed vision systems are useful for fast measurement and control of dynamic systems in general. When combined with external facilities such as high-speed projectors or acceleration sensors, they enable further wider applications including fast 3D measurement or object identification.

Graduate School of Information Sciences
KAGAMI, Shingo, Associate Professor Ph.D. (Eng.)

[3D printing]

Additive Manufacturing of Metallic Parts with Electron Beam Melting (EBM)

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Features
Electron beam melting (EBM) is a type of additive manufacturing technologies. EBM uses electron beam as an energy source to melt metal powder and produce metal thin layers. This sequence is repeated in a layer-by-layer manner to fabricate three-dimensional (3D) components.
This technology can produce any kinds of structures based on 3D CAD models and is suitable for custom-made manufacturing.
In addition, our recent studies revealed that the unique microstructure, such as directional solidification and uniform dispersions of fine precipitates, are obtained by EBM; this technology is useful to realize advanced materials that cannot be obtained conventional manufacturing.

Targeted Application(s)/Industry
The EBM technology has received much attention for producing metal parts used in biomedical, aerospace and automotive industries.
Rapid prototyping / rapid tooling is one of the applications of this technology.

Institute for Materials Reserach
CHIBA, Akihiko, Professor PhD

[3D-LSI/TSV]

Development of Biomedical Micro/Nano Integrated System Using LSI Technology

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Features
Semiconductor neural engineering is a discipline that uses semiconductor process/device/circuit technologies to further understand properties of neural systems and to create novel fusion systems of living body and machine.

Targeted Application(s)/Industry
One of the goals in this laboratory is to establish semiconductor neural engineering and develop biomedical micro/nano integrated systems.
Another goal is to educate the next generation of leaders in biomedical engineering through research including:
1. Intelligent Si neural probe and biomedical signal processing LSI
2. Fully-implantable retinal prosthesis system
3. Bio/nano technology and novel Bio-FET sensor
4. 3-dimensional integration technology and analog/digital LSI design

Graduate School of Biomedical Engineering
TANAKA, Tetsu, Professor Ph.D. (Engineering)