"Patents" Keyword - 2 Result(s)
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[Patents]
Indentation modulus 8.4 GPa! Resin replica mold more solid than polyimide | Masaru Nakagawa (Professor) |
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Liquefaction risk can be estimated without ground data | Motoki Kazama (Professor) |
Indentation modulus 8.4 GPa! Resin replica mold more solid than polyimide | Masaru Nakagawa (Professor) |
---|---|
Liquefaction risk can be estimated without ground data | Motoki Kazama (Professor) |