"TSV (Through-Silicon Via)" Keyword - 1 Result(s) T [TSV (Through-Silicon Via)] newCreating three-dimensional heterogeneous integration technology (chiplet integration technology) and bio-adaptive flexible hybrid electronics (FHE) to support next-generation AI and edge computing infrastructure. Takafumi Fukushima (Professor)
Medical
Life Sciences
Information Communication
Environment
Nanotechnology / Materials
Energy
Manufacturing Technology
Social Infrastructure
Frontier
Human and social sciences
