Novel Cu-Based Shape Memory Alloy with High Ductility
update：2020-06-16
Features
Recently, we have developed a novel Cu-Al-Mn based shape memory alloy with high SM properties and with a ductility twice higher than that in Nitinol . Furthermore, this novel SM alloy needs no die for the shape setting and is fabricated with relatively low cost. Very recently, we have successfully developed a device to cure ingrown toenail by using this SM alloy.Targeted Application(s)/Industry
Very recently, we established a fabrication process for the Cu-Al-Mn sheet, wire and bar with 0.1 - 20mm in thickness or diameter. We hope to conduct collaborative research with a willing company for a practical application with this new SM alloy.Researchers
Department of Materials Science, Graduate School of Engineering
KAINUMA Ryosuke
, Professor
Doctor of Engineering
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