Novel Cu-Based Shape Memory Alloy with High Ductility

Features and Uniqueness
  • Recently, we have developed a novel Cu-Al-Mn based shape memory alloy with high SM properties and with a ductility twice higher than that in Nitinol . Furthermore, this novel SM alloy needs no die for the shape setting and is fabricated with relatively low cost. Very recently, we have successfully developed a device to cure ingrown toenail by using this SM alloy.
Practical Application

Very recently, we established a fabrication process for the Cu-Al-Mn sheet, wire and bar with 0.1 - 20mm in thickness or diameter. We hope to conduct collaborative research with a willing company for a practical application with this new SM alloy.



Graduate School of Engineering

Ryosuke Kainuma, Professor
Doctor of Engineering