In addition to being the world's first to demonstrate "Chip-to-Wafer" stacking technology for 3D-ICs, our laboratory's major strengths lie in its advanced process integration capabilities, utilizing GINTI, a prototyping center for 300 mm wafers. Based on micro- and nano-fabrication and semiconductor packaging engineering, we are promoting the systematization of "holistic integration engineering," which goes beyond individual component technologies and integrates multiple fields such as design, materials, processing, measurement, and heat dissipation to achieve high performance and multi-functionality in semiconductor systems. This comprehensive research approach has led to a wide range of collaborative research with material, equipment, and device manufacturers both in Japan and overseas, and we continue to contribute to the development of advanced back-end processing technologies through industry-academia collaboration.