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Novel-Concept Silicon Integrated Circuits Derived from the 3-Dimensional Device, Circuit and Architecture

In recent year, facing the age of nanoscale engineering, the new technologies of device, circuit and architecture supported by novel physical guidance principles are highly expected, just as the similar situation as the predawn of semiconductor technology when Bardeen and Shockley discovered the secret of transistors. Therefore, in our research approach, the architectures, circuits, devices and CAD design tools for nanoscale LSI are systematically investigated in the following three main research subjects.
1. Study on nanoscale device and circuit
Aiming at the nanoscale silicon semiconductor integrated circuit, we are mainly working on the following directions for new devices and circuits:
①Analysis for novel physical phenomenon based on nanostructural effects
②Device and circuit technology with new operating principle
③Restraint technology for increasing variability of device characteristics
④Architecture and circuit technology for robust information processing
2. Study on the 3-dimention-structual device and circuit
The elementary element of recent LSI with planar-structural devices is coming close to the physical limitation of scaling. In order to break the limit and sustain the evolution of future LSI performance, we have started the research on the novel 3-dimension-structural devices and circuits.
3. research on wireless integrated circuit (IC) based on information transmission
The ultracompact lightweight wireless IC is one of essential technologies for realizing the ubiquitous society which has the network available in anywhere, at anytime and from any surrounding items. For example, the IC tags for receiving information with reading function are getting close to the practical applications. In our laboratory, aiming at the automatic operating wireless IC with embedded power supply, we are systematically working on the following directions:
①The electrical power generation and storage devices
②Devices and circuits with Ultralow power consumption
③Sensing devices
For all above subjects, We hope to conduct collaborative researches with companies interested in our research.


Center for Innovative Integrated Electronic Systems

ENDOH, Tetsuo , Professor
Doctor of Engineering