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Novel Cu-Based Shape Memory Alloy with High Ductility

update:2020-06-16
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Features

Recently, we have developed a novel Cu-Al-Mn based shape memory alloy with high SM properties and with a ductility twice higher than that in Nitinol . Furthermore, this novel SM alloy needs no die for the shape setting and is fabricated with relatively low cost. Very recently, we have successfully developed a device to cure ingrown toenail by using this SM alloy.

Targeted Application(s)/Industry

Very recently, we established a fabrication process for the Cu-Al-Mn sheet, wire and bar with 0.1 - 20mm in thickness or diameter. We hope to conduct collaborative research with a willing company for a practical application with this new SM alloy.

Researchers

Department of Materials Science, Graduate School of Engineering

KAINUMA, Ryosuke , Professor
Doctor of Engineering

Keywords

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