We offer shared facility for the development of semiconductor prototypes equipped with 4-inch, 6-inch and some 8-inch wafer fabrication tools available on an hourly basis. Know-how accumulated at Tohoku University is available, and staff provide maximum support for prototyping. The service is performed at the 1,200 m2 Super Clean Room on the second floor of the Junichi Nishizawa Memorial Research Centre at Tohoku University. For information on equipment and fees, see our website.

More than 10 experienced technical staff assist customer's usages. Standard process conditions for each process, such as etching and deposition, are provided. allowing customers to start prototyping immediately. Various materials other than silicon can also be supported.

• We support the development of devices and semiconductor materials such as MEMS, optical elements and RF components.
• Technical consultation on devices and processes before and during prototyping is also available.
• A
• 'Prototype lab' for device packaging is also available.
• The museums where you can learn about the history of semiconductors, measuring instruments and sensors are open.
• As part of Technology Co-creation for Semiconductor of Tohoku University, we promote R&D of semiconductors and the development of human resources.
• On-demand semiconductor human resource development programs for students and engineers are available.
• As a member of the MEXT's Advanced Research Infrastructure for Materials (ARIM) program, we are involved in sharing facility and data.

More than 330 companies have used our shared facility since its launch in 2010, not only from device manufacturers such as MEMS, but also from manufacturers of materials, mechanical components and equipment. To date, we have successfully supported the commercialization of about 10 devices.

• Molecular-scale mechanism of solid-liquid affinity, wettability, thermal boundary resistance and molecular deposition are analyzed by molecular dynamics simulations toward its control. With a background of heat and mass transport and interfacial thermodynamics, transport phenomena of various scales ranging from spin coating of photoresist to SAM (self-assembled monolayer) and hydrophobic/hydrophilic treatment by attaching some molecular basis are studied. Futhermore, the molecular-scale mechanisms which determine thermophysical properties and the molecular structure that realizes desired thermophysical properties are studied. We can conduct effective collaboration and provide academic consultations to companies interested in our research.

We offer shared facility for the development of semiconductor prototypes equipped with 4-inch, 6-inch and some 8-inch wafer fabrication tools available on an hourly basis. Know-how accumulated at Tohoku University is available, and staff provide maximum support for prototyping. The service is performed at the 1,200 m2 Super Clean Room on the second floor of the Junichi Nishizawa Memorial Research Centre at Tohoku University. For information on equipment and fees, see our website.

More than 10 experienced technical staff assist customer's usages. Standard process conditions for each process, such as etching and deposition, are provided. allowing customers to start prototyping immediately. Various materials other than silicon can also be supported.

• We support the development of devices and semiconductor materials such as MEMS, optical elements and RF components.
• Technical consultation on devices and processes before and during prototyping is also available.
• A
• 'Prototype lab' for device packaging is also available.
• The museums where you can learn about the history of semiconductors, measuring instruments and sensors are open.
• As part of Technology Co-creation for Semiconductor of Tohoku University, we promote R&D of semiconductors and the development of human resources.
• On-demand semiconductor human resource development programs for students and engineers are available.
• As a member of the MEXT's Advanced Research Infrastructure for Materials (ARIM) program, we are involved in sharing facility and data.

More than 330 companies have used our shared facility since its launch in 2010, not only from device manufacturers such as MEMS, but also from manufacturers of materials, mechanical components and equipment. To date, we have successfully supported the commercialization of about 10 devices.

• Atomic diffusion bonding of two flat wafers with thin metal films is a promising process to achieve wafer bonding at room temperature. High surface energies of metal films and a large atomic diffusion coefficient at the grain boundaries and film surfaces enable bonding at room temperature without unusually high loading pressure. This technique, which enables bonding of any mirror-polished wafer, is gaining wider use for fabricating optical and electrical devices. Moreover, bonding of mirror polished metals and polymer sheets can be achieved, which further extends the application of this bonding technique.

Optical, power and electrical devices, MEMS, bonding of polymer sheets, metals, and ceramics for precision mechanical equipments.

• The research is being focused on measurement of surface forms of precision workpieces and stage motions of precision machines, which are important items for ultra-precision manufacturing and nanomanufacturing. Optical sensors are being developed for measurement of angle and displacement, which are fundamental quantities for manufacturing. Technologies for improvement of the sensor sensitivity and bandwidth, reduction of the sensor size as well as new multi-axis sensing methods are being The research is being focused on measurement of surface forms of precision workpieces and stage motions of precision machines. Optical sensors are being developed for measurement of angle and displacement. A number of scanning-type measuring systems for precision measurement of surface forms and stage motions are also being developed. Error separation algorithms and systems for straightness and roundness, which are the most fundamental geometries treated in ultra-precision manufacturing, are being investigated. Novel systems based on scanning probe microscopy are under development for micro- and nano-structures as well as freeform optics in responding to new and important challenges from ultra-precision manufacturing and nanomanufacturing.

The multi-axis optical displacement and angle sensors developed in the laboratory are expected to measure motions of semiconductor/IC manufacturing and inspection equipment, precision machine tools, ultra-precision measuring instrument. The surface profile measurement systems are expected t play an important role in ultra-precision manufacturing and nanomanufacturing industries.