• Nakagawa group has dedicated to pursue scientific principles for molecular control of interface function occurring at polymer/other material interfaces and to put them into practice in nanoimprint lithography promising as a next generation nanofabrication tool. We are developing advanced photo-functional materials such as sticking molecular layers for "fix by light", UV-curable resins and antisticking molecular layers for "preparation by light", fluorescent resist materials for "inspection by light", and hybrid optical materials "available to light" and new research tools such as mechanical measurement systems to evaluate release property of UV-curable resins.

Our research aims at creating new devices to control photon, electron, and magnetism.

• Microwave processing is one of the attractive fields in recent materials processing. We perform various materials processing using non-equilibrium reaction field induced by microwave and/or ultrasonic irradiation. The topic contains powder metallurgy, nitride coatings, synthesis of new functional materials, fabrication of nanoparticles, etc. Recently we have developed a new TiN coating method using our microwave irradiation equipment operated at a frequency of 2.45 GHz. The method is simple but applicable to various substrates with complex shape. This method can be applied to various nitride coatings and will open a new coating technology in many fields of applications.

The major targets of TiN coatings are for cutting tools, ball bearings, dental implants, die and mold for stamping, and ornaments. The newly developed method makes it possible to perform nitride coatings within a short time using a standard microwave heating equipment. We hope to conduct collaborative research with a willing company for a practical application of these technology.

• The research is being focused on measurement of surface forms of precision workpieces and stage motions of precision machines, which are important items for ultra-precision manufacturing and nanomanufacturing. Optical sensors are being developed for measurement of angle and displacement, which are fundamental quantities for manufacturing. Technologies for improvement of the sensor sensitivity and bandwidth, reduction of the sensor size as well as new multi-axis sensing methods are being The research is being focused on measurement of surface forms of precision workpieces and stage motions of precision machines. Optical sensors are being developed for measurement of angle and displacement. A number of scanning-type measuring systems for precision measurement of surface forms and stage motions are also being developed. Error separation algorithms and systems for straightness and roundness, which are the most fundamental geometries treated in ultra-precision manufacturing, are being investigated. Novel systems based on scanning probe microscopy are under development for micro- and nano-structures as well as freeform optics in responding to new and important challenges from ultra-precision manufacturing and nanomanufacturing.

The multi-axis optical displacement and angle sensors developed in the laboratory are expected to measure motions of semiconductor/IC manufacturing and inspection equipment, precision machine tools, ultra-precision measuring instrument. The surface profile measurement systems are expected t play an important role in ultra-precision manufacturing and nanomanufacturing industries.

• Flexible liquid crystal displays using thin plastic film substrates instead of glass substrates contained in current liquid crystal displays, are bendable, thin, lightweight, and do not crack, and generate new usage styles and human interfaces due to their excellent storability and portability. We have been researching the basic technologies for large-screen and high-quality flexible displays using functional organic materials including liquid crystal and polymer, so that anyone can enjoy fertile information services.

We hope to conduct collaborative research with a willing company in industry, for development and practical application of the advanced flexible display technologies.

• Toward the ultimate performances of image sensors, advanced research activities are being conducted that cover a wide range of technology fields from cleanroom infrastructure, materials, process equipment, process, device, circuit, assembly, signal processing, measurement/evaluation and reliability. Following technologies have been successfully commercialized:
• A fast and accurate measurement technology of electrical characteristics for over 1 million transistors
• A wide dynamic range CMOS image sensor technology capturing images over five decade brightness ranges
• An ultra-fast CMOS image sensor technology with 10 million frames/sec

Followings are available for industry collaborators:
A. 200mm-diameter-wafer silicon device fabrication utilizing the ultra-clean facility including wafer mutual fabrication processing between device manufacturers.
B. Process technology development and various kinds of analyses.
C. Development of new image sensors.