• We have been developing methods for explicating the dominant factors that determine the physical and chemical properties of materials and stacked structures used in human societies. Since the number of element atoms which consists of advanced materials has been increasing, and the crystallographic structure of the materials has become very complicated, both the various properties and reliability of the materials fluctuate significantly in nano-scale, and thus, deteriorate easily due to the local damages of the materials.

To design the optimal structure, composition of materials, and the fabrication process of both materials and stacked structures, we are going to develop a method of analyzing the atomic structure of thin film materials based on quantum mechanics and experimental methods for measuring material properties, atomic scale damage or defects in nano-materials.

• Flexible liquid crystal displays using thin plastic film substrates instead of glass substrates contained in current liquid crystal displays, are bendable, thin, lightweight, and do not crack, and generate new usage styles and human interfaces due to their excellent storability and portability. We have been researching the basic technologies for large-screen and high-quality flexible displays using functional organic materials including liquid crystal and polymer, so that anyone can enjoy fertile information services.

We hope to conduct collaborative research with a willing company in industry, for development and practical application of the advanced flexible display technologies.

• Toward the ultimate performances of image sensors, advanced research activities are being conducted that cover a wide range of technology fields from cleanroom infrastructure, materials, process equipment, process, device, circuit, assembly, signal processing, measurement/evaluation and reliability. Following technologies have been successfully commercialized:
• A fast and accurate measurement technology of electrical characteristics for over 1 million transistors
• A wide dynamic range CMOS image sensor technology capturing images over five decade brightness ranges
• An ultra-fast CMOS image sensor technology with 10 million frames/sec

Followings are available for industry collaborators:
A. 200mm-diameter-wafer silicon device fabrication utilizing the ultra-clean facility including wafer mutual fabrication processing between device manufacturers.
B. Process technology development and various kinds of analyses.
C. Development of new image sensors.

• This lab is concerned with the novel approach mainly for the growth from melt by studying the relationship between the interface dynamics during growth and properties of grown crystals. Special interests lie in the growth of new crystals via the imposition of an interface-electric field. Nano-scaled control of crystal growth is executed in an electric double layer of ~nm thickness that is induced by applying an external electric field on the growth interface. Some of our growth results brought by applying an electric field are;
• 1. Growth of Langasite-type crystals for the pressure sensor at high temperature by manipulating the energy relationship between crystal and melt.
• 2. Easy nucleation of protein crystals that are normally hard to crystallize.
• 3. Formation of Si crystals with desired structure by manipulating the interface instability of Si.
• Crystals developed this way will widen an opportunity to collaborate with industries in the field of the piezoelectric, magnetic, optic and other fields related to the highly-networked information society.

We offer shared facility for the development of semiconductor prototypes equipped with 4-inch, 6-inch and some 8-inch wafer fabrication tools available on an hourly basis. Know-how accumulated at Tohoku University is available, and staff provide maximum support for prototyping. The service is performed at the 1,200 m2 Super Clean Room on the second floor of the Junichi Nishizawa Memorial Research Centre at Tohoku University. For information on equipment and fees, see our website.

More than 10 experienced technical staff assist customer's usages. Standard process conditions for each process, such as etching and deposition, are provided. allowing customers to start prototyping immediately. Various materials other than silicon can also be supported.

• We support the development of devices and semiconductor materials such as MEMS, optical elements and RF components.
• Technical consultation on devices and processes before and during prototyping is also available.
• A
• 'Prototype lab' for device packaging is also available.
• The museums where you can learn about the history of semiconductors, measuring instruments and sensors are open.
• As part of Technology Co-creation for Semiconductor of Tohoku University, we promote R&D of semiconductors and the development of human resources.
• On-demand semiconductor human resource development programs for students and engineers are available.
• As a member of the MEXT's Advanced Research Infrastructure for Materials (ARIM) program, we are involved in sharing facility and data.

More than 310 companies have used our shared facility since its launch in 2010, not only from device manufacturers such as MEMS, but also from manufacturers of materials, mechanical components and equipment. To date, we have successfully supported the commercialization of about 10 devices.